The Bavarian Semiconductor Congress (BSC) 2024 was held from June 2 to 6. With the themes “Artificial Intelligence as an Innovation Driver for Microelectronics” and “Sustainability as an Opportunity for the Bavarian Semiconductor and Electronics Industry,” BSC 2024 was organized by the Bavarian Ministry of Economic Affairs and Regional Development in collaboration with the Bavarian Chip Alliance.
This prestigious international conference brings together experts, professionals, and companies worldwide to discuss the latest developments, innovations, and trends in the semiconductor industry.
The UGM delegation, represented by the Vice Dean for Research, Community Service, and Cooperation at the Faculty of Engineering (FT UGM), Dr. Ali Awaludin, and the Head of the Information Engineering program at FT UGM, Dr. Agus Bejo, carried the mission to strengthen collaboration and innovation in the semiconductor field.
In addition to attending various presentation sessions and panel discussions, the UGM delegation and other participants visited a technology exhibition showcasing the latest products and solutions in semiconductors.
BSC 2024 was designed to enable collaboration among participants and foster growth and development in the global semiconductor industry.
After attending BSC, the UGM delegation continued visiting Regensburg’s Wafer Fab Infineon Technologies AG facility.
Infineon Technologies AG is one of the leading semiconductor companies in Germany. It produces ICs for various industries, including automotive and wireless communication.
“This visit provided deep insights into the production processes and advanced technologies used in IC manufacturing,” said Dr. Agus Bejo upon his return from Germany.
The delegation also visited Stuttgart University, ULM University, Dresden University, and Ferdinand-Braun-Institut (FBH), four leading German universities known for their semiconductor facilities. The visits aimed to evaluate the quality of these top campuses with semiconductor research.
Additionally, they explored opportunities for joint research collaborations and the signing of MoUs, which are expected to support the development of the semiconductor industry in Indonesia by sending master’s and doctoral students funded by Indonesia’s scholarship LPDP.
At BSC 2024, UGM, along with eleven other Indonesian universities, part of ICDeC, and representatives from the Ministry of Foreign Affairs, the Ministry of Education, and LPDP, were led by the Indonesian Ambassador to Germany, Arif Havas Oegroseno.
Oegroseno, who is also a member of the Semiconductor Task Force, explained that Indonesia’s main goal in participating in BSC 2024 is to increase the number of experts in the semiconductor field.
“The hope is that Indonesia can produce 500 experts within the next five years through master’s and doctoral scholarships in Germany with semiconductor topics and enhance the capacity of Indonesian researchers through joint research with professors in Germany,” he explained.
This activity supports several Sustainable Development Goals (SDGs), including strengthening quality education by increasing the capacity of experts and researchers in the semiconductor field and helping the sending of students for master’s and doctoral programs (SDG 4); strengthening semiconductor industry infrastructure in Indonesia (SDG 9); and strengthening global partnerships between universities and industries in Indonesia with institutions in Germany, facilitating the transfer of technology, knowledge, and innovation needed to achieve sustainable development goals (SDG 17).
Reporters: Dr. Agus Bejo/Rasya Swarnasta
Photographer: Dr. Agus Bejo